Horizon 4090u Product Specifications. Key parameters include: 4 μm system accuracy (including X, Y, θ, Z axes), up to 1.1G acceleration, and linear motor drive technology. It features 25/26 slots of automatic feeding and intelligent fast loading capabilities, and is compatible with major ATE test interfaces. Suitable for automated metrology needs of 100mm to 200mm (4-8 inch) wafers.
Wafer Handling
Automatic Wafer Sizing for 100mm”, 150mm, 200mm(4”, 5”, 6”,8”).
1 Cassette of 25 or 26 slots.
- Sequential.
- Programmable acces controllable via external I/O.
Auxiliary wafer tray.
Quick single wafer insertion and extration.
Cross slot wafer detection.
Intelligent Quickload pipelining.
Closed-loop material handling.
Accuracy
+-4 um(system accuracy includes X,Y,θ and Z)**
**definition available upon request.
XY Positioning
Travel-19.80”(503mm) X,9.42 (239mm)Y.
Maximum Speed-10.0 in/sec(254.0mm/sec).
Maximum Acceleration:
- Standard Configuration –1.1G X axis, 0.53GY axis.
- High Force Configuration-0.88G X axis, 0.42G Y axis.
Resolution-0.01 mils(0.25um).
Repeatability-0.01 mils(0.25um).
4080 Wafer Prober,for 4″, 5″, 6″, 8″, wafers,merges prower ful automation system software.
Unique linear motor material handling system provide accuate motion.
Wafer Size Capacity
Automatic Wafer Sizing for 4″, 5″, 6″, 8″,wafers.
Accuracy
Within 0.2 mil(5um).The placement of all die on all 10,8″ wafers in the Electrogals accuracy test are within 5um of the desired location.The 0,0 reference point is taught on a center die of the first wafer.
Tester Interface Packages
All major ATE manufactures.Motorized Probe Card Theta or Semi-Automatic Probe Card changer are available on certain tester application packages.